Browse Prior Art Database

Wafer Load and Centering Tool

IP.com Disclosure Number: IPCOM000043089D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Sutton, RJ: AUTHOR

Abstract

A semiconductor wafer loading and centering tool is disclosed which has a semi-circular contour to enable it to fit snugly against a circular wafer chuck. This enables the transporting and placing of a wafer, sitting on the tool, onto the spin spindle in a photoresist-coating operation. The wafer load and centering tool 1 is shown in the top view of Fig. 1 and in a cross-sectional view of Fig. 2. The tool consists of a semi-circular, horseshoe-shaped portion 2 which is mounted to the handle 6. A U-shaped opening 3 is formed in the semi-circular body 2 of the tool, having a circular end 4 to the opening 3 which is concentric with the circular body portion 2.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 74% of the total text.

Page 1 of 2

Wafer Load and Centering Tool

A semiconductor wafer loading and centering tool is disclosed which has a semi-circular contour to enable it to fit snugly against a circular wafer chuck. This enables the transporting and placing of a wafer, sitting on the tool, onto the spin spindle in a photoresist-coating operation. The wafer load and centering tool 1 is shown in the top view of Fig. 1 and in a cross-sectional view of Fig. 2. The tool consists of a semi-circular, horseshoe-shaped portion 2 which is mounted to the handle 6. A U-shaped opening 3 is formed in the semi-circular body 2 of the tool, having a circular end 4 to the opening 3 which is concentric with the circular body portion 2. A wafer ledge 5 of circular shape is formed on top of the circular body portion 2 and aligns a semiconductor wafer having substantially the same diameter as the circular ledge 5 so that it will be concentric with the body portion 2 of the tool. The circular end 4 of the opening 3 for the tool has substantially the same diameter as the spin spindle 7 for the spin chuck of a photoresist coater. The silicon wafer is placed within the ledge 5 of the tool, and the tool is brought into proximity with the spin spindle 7 so that the circular end 4 of the opening 3 of the tool is placed in contact with the cylindrical surface of the spin spindle 7. This aligns the geometric center of the wafer with the center of the spin spindle which is concentric with the tool body 2. The tool body has b...