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Bonding Registered Assemblies

IP.com Disclosure Number: IPCOM000043096D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Hatchett, MR: AUTHOR [+2]

Abstract

A bonding technique is described for a recording head. An adhesive is used which cures slowly with an activator and quickly when exposed to ultraviolet (UV) light. After the parts to be bonded have been precisely registered in a jig with the adhesive in place, the visible portion of the adhesive is cured quickly by exposure to UV light. This secures the parts temporarily, allowing the jig to be removed while the remainder of the adhesive completes curing slowly. The diagram shows a ceramic post to be bonded to an aluminum arm during manufacture of a recording head. The steps in the bonding technique follow: 1. The mating surfaces of the post and arm are coated with an activator by spraying, dipping or other suitable coating method, and the activator is allowed to dry. 2.

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Bonding Registered Assemblies

A bonding technique is described for a recording head. An adhesive is used which cures slowly with an activator and quickly when exposed to ultraviolet (UV) light. After the parts to be bonded have been precisely registered in a jig with the adhesive in place, the visible portion of the adhesive is cured quickly by exposure to UV light. This secures the parts temporarily, allowing the jig to be removed while the remainder of the adhesive completes curing slowly. The diagram shows a ceramic post to be bonded to an aluminum arm during manufacture of a recording head. The steps in the bonding technique follow: 1. The mating surfaces of the post and arm are coated with an activator by spraying, dipping or other

suitable coating method, and the activator is allowed

to dry. 2. The mating surfaces are coated with adhesive

resin, and the post and arm are assembled as shown,

forming an adhesive fillet at the mating surfaces. 3. The assembly is placed in a registration jig, and the parts positioned in respect to each other within

the required tolerance. 4. Ultraviolet light is used to cure the exposed adhesive fillets which cure within 20 seconds, after

which the bonded assembly is removed from the

registration jig, which may be reused for the next

assembly. 5. Within three hours the adhesive not exposed cures

with the activator. For some anaerobic adhesive resins

it may be necessary to remove the adhesive surface

layer by wiping with a suitab...