Browse Prior Art Database

Small-Outline Laser Diode Sub-Module

IP.com Disclosure Number: IPCOM000043103D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+2]

Abstract

This article discloses a small-outline laser diode sub-module which may be incorporated in present integrated circuit packages. A lead frame 1 consists of an etched metal foil that has been photolitographically defined with geometry and dimensions that mirror a silicon optical bench (SOB) 2. Lead frame 1 has extensions 3 carrying solder 4 at their distal ends for bonding to SOB 2. SOB 2 has etched and metallized areas, shown as cross-hatched areas in Fig. 1. For assembling of the sub-module, laser diode 5 is bonded to SOB 2. Optical waveguide 6 and cylindrical lens 7 are assembled on SOB 2 by clamps 8. Lead frame 1 is then soldered to SOB 2, which in turn is soldered to a heat spreader 9 through layer 10.

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Small-Outline Laser Diode Sub-Module

This article discloses a small-outline laser diode sub-module which may be incorporated in present integrated circuit packages. A lead frame 1 consists of an etched metal foil that has been photolitographically defined with geometry and dimensions that mirror a silicon optical bench (SOB) 2. Lead frame 1 has extensions 3 carrying solder 4 at their distal ends for bonding to SOB 2. SOB 2 has etched and metallized areas, shown as cross-hatched areas in Fig. 1. For assembling of the sub-module, laser diode 5 is bonded to SOB 2. Optical waveguide 6 and cylindrical lens 7 are assembled on SOB 2 by clamps 8. Lead frame 1 is then soldered to SOB 2, which in turn is soldered to a heat spreader 9 through layer 10. The above is followed by enclosure with a non-transparent cover 11 which provides a closed optical environment for the laser diode sub- module, as well as for the integrated circuit package. A washer 12 is interposed between SOB 2 and cover 11. Fig. 2 depicts the assembled laser diode sub- module.

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