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Precision Tooling for the Placement of Locating Features in Microcircuit Masks

IP.com Disclosure Number: IPCOM000043107D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Lahey, GL: AUTHOR [+4]

Abstract

A series of thin metal masks used in fabricating high density multilayer circuits are registered precisely relative to a prepositioned ceramic green sheet. As shown in the drawing, a punch plate 1 is raised to accept a metal mask 9 that is located by four pins 14, which position the mask accurately relative to the punches 13. When a start button is depressed, the punch plate 1 is brought in contact with the mask 9 by a hydraulically actuated rod 6. The punch plate 1 is located on the die plate 2 using three pneumatically operated pins 4, and the punch plate is locked to the die plate using pneumatic locks 5. Thereafter, five punches 13 are activated punching the new locating holes in the mask 9 and mating with holes 15.

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Precision Tooling for the Placement of Locating Features in Microcircuit Masks

A series of thin metal masks used in fabricating high density multilayer circuits are registered precisely relative to a prepositioned ceramic green sheet. As shown in the drawing, a punch plate 1 is raised to accept a metal mask 9 that is located by four pins 14, which position the mask accurately relative to the punches 13. When a start button is depressed, the punch plate 1 is brought in contact with the mask 9 by a hydraulically actuated rod 6. The punch plate 1 is located on the die plate 2 using three pneumatically operated pins 4, and the punch plate is locked to the die plate using pneumatic locks 5. Thereafter, five punches 13 are activated punching the new locating holes in the mask 9 and mating with holes 15. Then the punches 13 are withdrawn, locks 5 and punch plate to die plate locating pins 4 are withdrawn, and punch plate 1 is raised to the open position by rod 6.

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