Browse Prior Art Database

Cooling Element for Component Chip

IP.com Disclosure Number: IPCOM000043130D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Sassen, B: AUTHOR

Abstract

The cooling element described is designed to decrease semiconductor chip temperature by conducting heat away from the chip to an external heat sink mounted on the case. A thermal conductor spring 1, as shown in Fig. 1, is made of tempered beryllium copper, aluminum or similar material and formed to make contact between a semiconductor chip and the periphery of the case. Fig. 2 shows the position of the thermal conductor spring 1 as viewed from the top with the cap removed. Contact pressure on the chip 2 is controlled by the temper and thickness of the spring material and by forming the fingers to a predetermined angle. Control of spring pressure on the chip is easily obtainable despite broad manufacturing tolerances of chip 6 and case 3. Case 3 has a heat sink 4 bonded or brazed to the entire top surface of the case.

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Cooling Element for Component Chip

The cooling element described is designed to decrease semiconductor chip temperature by conducting heat away from the chip to an external heat sink mounted on the case. A thermal conductor spring 1, as shown in Fig. 1, is made of tempered beryllium copper, aluminum or similar material and formed to make contact between a semiconductor chip and the periphery of the case. Fig. 2 shows the position of the thermal conductor spring 1 as viewed from the top with the cap removed. Contact pressure on the chip 2 is controlled by the temper and thickness of the spring material and by forming the fingers to a predetermined angle. Control of spring pressure on the chip is easily obtainable despite broad manufacturing tolerances of chip 6 and case 3. Case 3 has a heat sink 4 bonded or brazed to the entire top surface of the case. This provides optimum heat transmissibility to ambient air. Thermal grease may be applied to the contact surface, at 5, to further enhance the heat flow.

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