Browse Prior Art Database

Parallel Fin Conduction Module

IP.com Disclosure Number: IPCOM000043152D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Gupta, OR: AUTHOR [+2]

Abstract

The Parallel Fin Conduction Module (PFCM), as shown in Figs. 1 and 2, provides internal and external heat dissipating characteristics that are unique in electronic circuit packaging technology. The PFCM cap 1 is crimped onto substrate 2. The integrated circuit chip 3 is mounted onto the substrate with solder conduction balls 4. Thermal grease 5 may be used between chip 3 and the PFCM cap 1. The internal cavity of the PFCM cap 1 has standoffs 6 at each of the four corners to provide proper spacing between the chip 3 and the cap 1. The thinned section of the cap flange 7 allows crimping to take place before applying and curing the SCOTCHCAST*.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 92% of the total text.

Page 1 of 2

Parallel Fin Conduction Module

The Parallel Fin Conduction Module (PFCM), as shown in Figs. 1 and 2, provides internal and external heat dissipating characteristics that are unique in electronic circuit packaging technology. The PFCM cap 1 is crimped onto substrate 2. The integrated circuit chip 3 is mounted onto the substrate with solder conduction balls 4. Thermal grease 5 may be used between chip 3 and the PFCM cap 1. The internal cavity of the PFCM cap 1 has standoffs 6 at each of the four corners to provide proper spacing between the chip 3 and the cap 1. The thinned section of the cap flange 7 allows crimping to take place before applying and curing the SCOTCHCAST*. The thinning of the PFCM 1 at the periphery 8 provides flexibility to the cap at that cross-section to relieve the stress that builds up from the differing coefficients of expansion of the dissimilar materials, in this case, SCOTCHCAST, ceramic and metal, which are in intimate contact. The fin 9 is parallel to the substrate 2 and provides a two fold increase in the heat dissipating surface area. The heat dissipating efficiency of the fin 9 is high since it is connected, without interface, to the main module by center stem
10. Since the fin 9 is parallel to the substrate 2 and symmetrical about the center stem 10, it is not sensitive to air flow direction. Two corners 11 have 45-degree chamfers that provide orientation markings. A series of holes 12 and indentations 13 further increase the heat d...