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Browse Prior Art Database

Thermoelectrically Assisted Convection-Cooled Sealed Electronic Package

IP.com Disclosure Number: IPCOM000043171D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Skobern, JR: AUTHOR

Abstract

Described is a thermoelectrically assisted convection-cooled electronic package that provides for heat dissipation in applications where the package must be sealed, as in corrosive environments. The package, as shown in the drawing, is made up of a sealed enclosure 6 that contains an electronic printed circuit board 4 and a number of printed circuit cards 5. A thermoelectric cold sink 3 is located above the printed circuit card area. A thermal barrier plate 7 separates hot electronic cards from the sidewall of the enclosure 6 and provides a cold air channel to direct chilled air to the base of the printed circuit cards 5. As the warmed air rises to the top of the enclosure, the heat is dissipated by the cold sink 3, heat sink 2, and fan 1 and thermoelectric devices 8 operating according to the Peltier effect.

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Thermoelectrically Assisted Convection-Cooled Sealed Electronic Package

Described is a thermoelectrically assisted convection-cooled electronic package that provides for heat dissipation in applications where the package must be sealed, as in corrosive environments. The package, as shown in the drawing, is made up of a sealed enclosure 6 that contains an electronic printed circuit board 4 and a number of printed circuit cards 5. A thermoelectric cold sink 3 is located above the printed circuit card area. A thermal barrier plate 7 separates hot electronic cards from the sidewall of the enclosure 6 and provides a cold air channel to direct chilled air to the base of the printed circuit cards 5. As the warmed air rises to the top of the enclosure, the heat is dissipated by the cold sink 3, heat sink 2, and fan 1 and thermoelectric devices 8 operating according to the Peltier effect.

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