Browse Prior Art Database

Pressure Equalization for Heat Sink Bonding

IP.com Disclosure Number: IPCOM000043190D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

DiPaolo, N: AUTHOR [+2]

Abstract

During solder bonding of solder-coated, finned metal heat sinks to ceramic caps, pressure is required to keep the heat sink from floating on the molten solder. Because of dimensional irregularities in heat sink height, a means of pressure equalization is required. This is accomplished by placing a layer of high temperature elastomer, such as silicon rubber, between the pressure platen and the top of the heat sink. To prevent solder adherence to the elastomer pad and/or rubber adherence to the heat sink, a thin layer of soft, non-wetting polymer, such as polyimide, is placed between the silicon rubber and the solder coated heat sink.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Pressure Equalization for Heat Sink Bonding

During solder bonding of solder-coated, finned metal heat sinks to ceramic caps, pressure is required to keep the heat sink from floating on the molten solder. Because of dimensional irregularities in heat sink height, a means of pressure equalization is required. This is accomplished by placing a layer of high temperature elastomer, such as silicon rubber, between the pressure platen and the top of the heat sink. To prevent solder adherence to the elastomer pad and/or rubber adherence to the heat sink, a thin layer of soft, non-wetting polymer, such as polyimide, is placed between the silicon rubber and the solder coated heat sink.

1