Browse Prior Art Database

Small Computer Interface Relay Boards

IP.com Disclosure Number: IPCOM000043203D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Becker, J: AUTHOR

Abstract

A versatile high density interface between small computer hardware and AC powered equipment is achieved using a digital output line bus transceiver interface stage and a solid-state relay stage. The function of the stages are as shown in the drawing. The bus transceiver interface stage is constructed with 96 parallel lines so as to interface with Intel 8255 programmable digital output chips and to drive power levels up to compatibility with solid-state relays, triacs, or silicon-controlled rectifiers (SCRs). Compatibility is achieved with Intel bus transceiver ICs (octal), and no passive elements are required to source 3 mA or sink 15 mA. The solid-state relays which operate at 120 volts AC @ 1.0 or 1.5 amps such as Teledyne optically coupled SCRs and is arranged with 48/120 VAC interface outputs.

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Small Computer Interface Relay Boards

A versatile high density interface between small computer hardware and AC powered equipment is achieved using a digital output line bus transceiver interface stage and a solid-state relay stage. The function of the stages are as shown in the drawing. The bus transceiver interface stage is constructed with 96 parallel lines so as to interface with Intel 8255 programmable digital output chips and to drive power levels up to compatibility with solid-state relays, triacs, or silicon-controlled rectifiers (SCRs). Compatibility is achieved with Intel bus transceiver ICs (octal), and no passive elements are required to source 3 mA or sink 15 mA. The solid-state relays which operate at 120 volts AC @ 1.0 or 1.5 amps such as Teledyne optically coupled SCRs and is arranged with 48/120 VAC interface outputs. The two stages achieve the following. - Allow Intel 8255 digital outputs to drive bipolar devices through the bus transceiver stage by itself. - Integrate solid-state relays to the dual in-line package (DIP) integrated circuit level using for example, Teledyne DIP relays. - Interface 96/120 VAC @ 1.5 amp devices per pair of stages. - Ease of printed circuit board construction since there are no passive elements and the use of transistor-transistor logic (TTL) current sinking convention minimizes power dissipation.

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