Browse Prior Art Database

Module System Refrigeration Concept

IP.com Disclosure Number: IPCOM000043211D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Chan, JY: AUTHOR [+5]

Abstract

The Module System Refrigeration (MSR) concept uses the thermodynamic properties of refrigerants to remove heat from a high power density heat source (HPDHS) by a Direct Expansion Module (DXM) and to reject the heat to the ambient air. The unique characteristics of the MSR concept are the DXM and its precision controls. The compressor 1 raises the pressure of the refrigerant to a high enough value such that the condenser operating temperature is higher than the ambient. At the condenser 2, the refrigerant changes phase from vapor to liquid by rejecting heat received from the HPDHSs into the ambient air. The high pressure and temperature liquid refrigerant from the condenser enters the expansion devices 3 and expands in two stages to a low pressure, first in the expansion devices and then in the DXMs 4.

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Module System Refrigeration Concept

The Module System Refrigeration (MSR) concept uses the thermodynamic properties of refrigerants to remove heat from a high power density heat source (HPDHS) by a Direct Expansion Module (DXM) and to reject the heat to the ambient air. The unique characteristics of the MSR concept are the DXM and its precision controls. The compressor 1 raises the pressure of the refrigerant to a high enough value such that the condenser operating temperature is higher than the ambient. At the condenser 2, the refrigerant changes phase from vapor to liquid by rejecting heat received from the HPDHSs into the ambient air. The high pressure and temperature liquid refrigerant from the condenser enters the expansion devices 3 and expands in two stages to a low pressure, first in the expansion devices and then in the DXMs 4. In this step of the total process, the two-phase flow of the liquid and vapor takes place in the devices. The low pressure of the refrigerant is responsible for low temperature, and hence can remove heat from the HPDHS. The basic controls provide individual dynamic module temperature compensation based on various module designs and also provide intelligent response to external and internal cooling load variations. This can be achieved by controlling the temperature at the DXM by means of a feedback loop to the expansion device and/or the Electronic Control Box 5.

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