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Glass Trench Fill in High Pressure Ambients

IP.com Disclosure Number: IPCOM000043219D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Beyer, KD: AUTHOR [+3]

Abstract

Glass-filled trenches or grooves may be formed in semiconductor structures to act as isolation regions between semiconductor devices. The trench dimensions are, for example, a width of between about 1 to 4 mm and a depth of up to about 6 mm. The glass may be deposited onto the semiconductor surface having trenches by the sedimentation, centrifugation or spin-on of colloidal glass particles and followed by a heating step to coalesce the particles into a glass layer. Alternatively, the glass layer may be formed directly by sputtering, evaporation or chemical vapor deposition onto the semiconductor surface having the trenches. The trenches will not be completely filled after the initial deposition steps where the trench width is small.

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Glass Trench Fill in High Pressure Ambients

Glass-filled trenches or grooves may be formed in semiconductor structures to act as isolation regions between semiconductor devices. The trench dimensions are, for example, a width of between about 1 to 4 mm and a depth of up to about 6 mm. The glass may be deposited onto the semiconductor surface having trenches by the sedimentation, centrifugation or spin-on of colloidal glass particles and followed by a heating step to coalesce the particles into a glass layer. Alternatively, the glass layer may be formed directly by sputtering, evaporation or chemical vapor deposition onto the semiconductor surface having the trenches. The trenches will not be completely filled after the initial deposition steps where the trench width is small. The complete filling of the trenches and planarization are accomplished by an application of heat and pressure of between about 10 to 25 atmospheres. One example of the process involves the use of a Corning 7723* lead borosilicate glass. A 4 mm Corning 7723 glass layer was deposited by centrifugal sedimentation of a measured amount of a colloidal Corning glass 7723 glass suspension. After an initial heat treatment in O2 at normal atmospheric pressure and at 850OEC for 25 minutes, a 4 mm thick Corning 7723 glass layer did not fill a 1 mm wide trench. After an additional 25- minute heat treatment at 850OEC and in O2 at a pressure of 25 atmospheres, the Corning 7723 glass filled a major portion...