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In-Situ Polymer Film Adhesion Tester

IP.com Disclosure Number: IPCOM000043230D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Niu, TF: AUTHOR [+3]

Abstract

Using either ultrasonic shear or compression waves to measure the adhesion between polymers and metals or other substrate materials allows a nondestructive quantification of interlayer adhesion in an in-situ condition. The ultrasonic waves can be a measure of the modulus changes of a polymer (cure) as a function of time and temperature. On completion of the cure, the wave can decay. This is due to the degradation of the adhesive bond between the polymer and the other material. The extent of this condition can be quantified and related to product adhesion. Therefore, as a function of time, temperature, humidity and process conditions, this system can be used to model adhesion loss with respect to prior history.

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In-Situ Polymer Film Adhesion Tester

Using either ultrasonic shear or compression waves to measure the adhesion between polymers and metals or other substrate materials allows a nondestructive quantification of interlayer adhesion in an in-situ condition. The ultrasonic waves can be a measure of the modulus changes of a polymer (cure) as a function of time and temperature. On completion of the cure, the wave can decay. This is due to the degradation of the adhesive bond between the polymer and the other material. The extent of this condition can be quantified and related to product adhesion. Therefore, as a function of time, temperature, humidity and process conditions, this system can be used to model adhesion loss with respect to prior history.

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