Browse Prior Art Database

Cap Seating Mechanism

IP.com Disclosure Number: IPCOM000043235D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Barnhart, SR: AUTHOR [+4]

Abstract

When capping substrates, chip breakage can be reduced by applying a precise weight to the chip and by controlling and monitoring the velocity of the capping air cylinder with a hydraulic check cylinder and a velocity meter. Thus, a precise, repeatable impact velocity and pressure can be insured for each capping process. The steps in the capping process are as follows: 1. Cap 1 is placed in the capping station 2 over the substrate. 2. Air cylinder 3 is energized. The ram 4 rapidly descends until it makes contact with the nut 5. Hydraulic check 6 slows down the ram to about 1 ft/min (about " from capping station 2). 3. The dead weight 7 makes very gentle contact with the capping station 2, and the capping is complete. 4. The mechanism retreats to its starting point.

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Cap Seating Mechanism

When capping substrates, chip breakage can be reduced by applying a precise weight to the chip and by controlling and monitoring the velocity of the capping air cylinder with a hydraulic check cylinder and a velocity meter. Thus, a precise, repeatable impact velocity and pressure can be insured for each capping process. The steps in the capping process are as follows: 1. Cap 1 is placed in the capping station 2 over the substrate. 2. Air cylinder 3 is energized. The ram 4 rapidly

descends until it makes contact with the nut 5.

Hydraulic check 6 slows down the ram to about 1

ft/min (about " from capping station 2). 3. The dead weight 7 makes very gentle contact with the capping station 2, and the capping is

complete. 4. The mechanism retreats to its starting point.

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