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Silicone-Polyimide Polymers As Adhesion Promoters

IP.com Disclosure Number: IPCOM000043242D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Anderson, DR: AUTHOR [+5]

Abstract

Silicone-polyimide polycondensation polymers either in the polyamic state or prepolymerized, when diluted to low solids of 1-10%, can be used as adhesion promoters. The silicone segment of the silicone- polyimide copolymer (SPC) serves to impart excellent wetting, adhesion, and resistance to moisture at the interface. The polyimide segment of the SPC can react with or solubilize the subsequent polyimide coating to form an inseparable interpenetrating network. Use of the silicone polyimide as a prepolymer (polyamic acid) can be used to advantage to react with a monomeric or polyamic system so that, with cure, the promoter and coating may co-cure. Either an imidized or a non-imidized polyimide coating can be used with either an imidized or a non-imidized SPC.

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Silicone-Polyimide Polymers As Adhesion Promoters

Silicone-polyimide polycondensation polymers either in the polyamic state or prepolymerized, when diluted to low solids of 1-10%, can be used as adhesion promoters. The silicone segment of the silicone- polyimide copolymer (SPC) serves to impart excellent wetting, adhesion, and resistance to moisture at the interface. The polyimide segment of the SPC can react with or solubilize the subsequent polyimide coating to form an inseparable interpenetrating network. Use of the silicone polyimide as a prepolymer (polyamic acid) can be used to advantage to react with a monomeric or polyamic system so that, with cure, the promoter and coating may co-cure. Either an imidized or a non-imidized polyimide coating can be used with either an imidized or a non-imidized SPC. This broad mutual reactivity can yield varied adhesion promoter characteristics: thin or thick interface, ductile, rigid, soluble, insoluble, etc. In addition to excellent adhesion and moisture resistance at the bond interface, SPC materials can significantly reduce stress in the polyimide coating due to SPC ductility. Reduced stress in the coating would reduce stress-induced cracks.

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