Browse Prior Art Database

Integral Heat Sink/Module Cap

IP.com Disclosure Number: IPCOM000043252D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Furkay, SS: AUTHOR [+2]

Abstract

Optimum design of extended surface cooling hardware for modules in a card-on-board environment, especially in the restrictive 5/8" card pitch, involves a trade-off between maximizing heat transfer area while minimizing hydraulic flow resistance of the extended surface. Maximizing heat transfer area restricts the free flow area to a point where the cooling flow is diverted from the module to the much wider card column. On the other hand, allowing a large flow area usually restricts the available heat transfer area. The proposed design incorporates the best features of two common extended surface configurations: pin fins and a horizontal fin supported by a central column. The single horizontal fin 11 provides a large heat transfer area and also a good surface for identification marking.

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Integral Heat Sink/Module Cap

Optimum design of extended surface cooling hardware for modules in a card- on-board environment, especially in the restrictive 5/8" card pitch, involves a trade-off between maximizing heat transfer area while minimizing hydraulic flow resistance of the extended surface. Maximizing heat transfer area restricts the free flow area to a point where the cooling flow is diverted from the module to the much wider card column. On the other hand, allowing a large flow area usually restricts the available heat transfer area. The proposed design incorporates the best features of two common extended surface configurations: pin fins and a horizontal fin supported by a central column. The single horizontal fin 11 provides a large heat transfer area and also a good surface for identification marking. The pin fins 12 upon which it is supported accomplish a number of tasks: 1) provide greater heat transfer surface area than the standard center column design; 2) pose less coolant flow restriction due to the in-line configuration of small diameter pins; 3) allow a more evenly distributed heat flow path from cap 13 to the fin; and 4) decrease the heat flow path length from the cap periphery to the upper fin. The proposed design has no preferred orientation with respect to card insertion, thereby adding a degree of freedom to the card designer. Furthermore, the proposed design provides a solid conduction path from the cap to the fin surface, thus elimina...