Browse Prior Art Database

Separable, Conformal, Low Profile Connector Means

IP.com Disclosure Number: IPCOM000043281D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 3 page(s) / 84K

Publishing Venue

IBM

Related People

Ecker, ME: AUTHOR

Abstract

Presently, interconnection systems for components are accomplished by soldering component pins into plated-through-holes, or inserting into spring contact connectors. There is a movement in the industry to utilize surface contact and solderable components. This article provides a low profile, tri-axial compensation connection with trifurcated wiping action for pinless component interconnection. An embodiment is shown in Fig. 1. An array of copper balls or bumps is disposed on the underside of the substrate and a flex cable system. In the case of copper balls (gold plated), the balls are attached as follows: 1. A suitable solder, or gold epoxy, is screened onto the pad array on the underside of the module (component). 2.

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Separable, Conformal, Low Profile Connector Means

Presently, interconnection systems for components are accomplished by soldering component pins into plated-through-holes, or inserting into spring contact connectors. There is a movement in the industry to utilize surface contact and solderable components. This article provides a low profile, tri-axial compensation connection with trifurcated wiping action for pinless component interconnection. An embodiment is shown in Fig. 1. An array of copper balls or bumps is disposed on the underside of the substrate and a flex cable system. In the case of copper balls (gold plated), the balls are attached as follows: 1. A suitable solder, or gold epoxy, is screened onto the pad array on the underside of the

module (component).

2. A template having apertures on the same grid as

the pad array on the component (module) is placed

over the pad array of the component (module).

3. Gold-plated copper balls are then vibrated over

the template so that each aperture contains a

copper ball. 4. If the copper balls are to be soldered, then

they are scheduled through an oven with the

appropriate temperature. If the copper balls are

bonded to conductive gold epoxy, the balls are

pressed into the screened gold epoxy paste, then

cured accordingly. The copper balls may be similarly attached to the flex cable assembly or any other organic wiring medium. The conformal interconnection scheme is shown in the exploded view of Fig. 1 and is located between the substrate and flex cable with balls solder-attached. The conformal connector is comprised of a top and bottom molded elastomeric retainer or carrier. A cluster of 3- balls (gold plated) is inserted into an appropriate array of wells molded into the elastomeric container halves. The elastomeric cont...