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Browse Prior Art Database

Method for Improving Plating Uniformity in Micron and Submicron Thin Film Devices

IP.com Disclosure Number: IPCOM000043297D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 96K

Publishing Venue

IBM

Related People

Santini, HA: AUTHOR [+2]

Abstract

A method of improving plating uniformity involves positioning removable artifacts near or around the object to be plated. These artifact areas and shapes are custom designed for the specific portion of the chip that is being plated. Experiments show that non-uniformity is related to the degree to which elements are isolated from one another within the patterns plated; i.e., an isolated line with no elements surrounding it will be thicker than elements plated with closely spaced neighbors. In the plating of magnetic bubble devices 10 (Fig. 1), the resulting thickness 12 non-uniformity led to a difference in resistance between the active sensor 14 and the dummy thick film sensor 16 resistances.

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Method for Improving Plating Uniformity in Micron and Submicron Thin Film Devices

A method of improving plating uniformity involves positioning removable artifacts near or around the object to be plated. These artifact areas and shapes are custom designed for the specific portion of the chip that is being plated. Experiments show that non-uniformity is related to the degree to which elements are isolated from one another within the patterns plated; i.e., an isolated line with no elements surrounding it will be thicker than elements plated with closely spaced neighbors. In the plating of magnetic bubble devices 10 (Fig. 1), the resulting thickness 12 non-uniformity led to a difference in resistance between the active sensor 14 and the dummy thick film sensor 16 resistances. In this case the area density of the plated elements surrounding the active sensor 14 was greater than that of the dummy sensor 16, with the result that the active sensor 14 was in general plated thinner than the dummy sensor 16. As shown in Fig. 2, an artifact area or shape 18 is positioned near the dummy sensor 16 which previously had had the thicker plating thickness. With the artifact 18 present during the plating, the thickness 12 is substantially the same near the active sensor 14 as it is near the dummy sensor 16.

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