Browse Prior Art Database

Wafer-Aligning Feature for a Wafer-Lifting Device

IP.com Disclosure Number: IPCOM000043311D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Miklos, MJ: AUTHOR [+2]

Abstract

This invention eliminates the need for separate pick-up and deposit wafer-handling devices. At the present time, automated wafer-handling equipment uses Bernoulli air flow wafer-lifting devices to remove or deposit wafers from or into recessed pockets in machines, such as sputtering equipment anodes. The geometry of clearances and given tolerances of both the tools and the wafers at the present time require two different diameters within which the transported wafers must align. Thus, these two different diameters result in a need for two different pick-up tools. The wafer-aligning diameter or deposit device diameter must be smaller than the diameter of the recessed pocket into which it is to be inserted.

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Wafer-Aligning Feature for a Wafer-Lifting Device

This invention eliminates the need for separate pick-up and deposit wafer- handling devices. At the present time, automated wafer-handling equipment uses Bernoulli air flow wafer-lifting devices to remove or deposit wafers from or into recessed pockets in machines, such as sputtering equipment anodes. The geometry of clearances and given tolerances of both the tools and the wafers at the present time require two different diameters within which the transported wafers must align. Thus, these two different diameters result in a need for two different pick-up tools. The wafer-aligning diameter or deposit device diameter must be smaller than the diameter of the recessed pocket into which it is to be inserted. Also, the wafer-aligning diameter of the pick-up tool must be larger than the diameter of the recessed pocket from which it is being picked. Use of two different tools, as is done at the present time, is costly, complex, and slow. The present invention, however, solves the problem of requiring two different tools by the simple incorporation of spring-biased conical, retractable pins 10 around the perimeter of the pick-up tool 11, as shown in the figure. The invention works as follows. If for the sake of simplicity, we assume that the device is already carrying a wafer, as shown in Fig. 1A, then the device head 11 is lowered onto and rests on a surface 12 containing a recessed pocket 13 into which the wafer 14 is to be deposited. As the head 11 presses against the surface 12, the tapered pins are pushed into the head. When the entire head is seated in the proper position, the air supply is switched off and the wafer drops into...