Browse Prior Art Database

Vertically Mounted Module

IP.com Disclosure Number: IPCOM000043327D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Hermann, K: AUTHOR [+4]

Abstract

Vertically mounted modules provide more effective use of high density printed circuitry. Fig. 1 illustrates the basic concept of the module. Chips 11 are mounted on one or both sides of a vertical substrate. Crossover clips 12 are used if interconnections are required between chips on two sides or a chip on one side and I/O connectors on the other. Metal I/O connectors 13 may be surface attached along the bottom edge of one or both sides. The length of I/O connectors 13 is chosen to compensate for thermal mismatch. Fig. 2 shows two modules surface soldered to a card. One of the modules 14 has metal I/O connectors 13; the other one 15 does not. In the latter case, the module metallization is used (directly) in lieu of the metal I/O connectors 13. This may be adequate in thermally matched applications.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Vertically Mounted Module

Vertically mounted modules provide more effective use of high density printed circuitry. Fig. 1 illustrates the basic concept of the module. Chips 11 are mounted on one or both sides of a vertical substrate. Crossover clips 12 are used if interconnections are required between chips on two sides or a chip on one side and I/O connectors on the other. Metal I/O connectors 13 may be surface attached along the bottom edge of one or both sides. The length of I/O connectors 13 is chosen to compensate for thermal mismatch. Fig. 2 shows two modules surface soldered to a card. One of the modules 14 has metal I/O connectors 13; the other one 15 does not. In the latter case, the module metallization is used (directly) in lieu of the metal I/O connectors 13. This may be adequate in thermally matched applications. Vertically mounted modules can be attached to the next level of package together with standard modules. This next level package could be a conventional edge connected card or a horizontally mounted structure similar to a TCM (thermal conduction module). This horizontally mounted structure could be plugged into a multilayer printed circuit board along with TCMs.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]