Browse Prior Art Database

Composite Solder Coil Interconnection

IP.com Disclosure Number: IPCOM000043329D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Noth, RW: AUTHOR

Abstract

As shown in the figure, which is a longitudinal sectional view, substrate A is connected to substrate B by a composite solder connection to provide electrical connection between the substrates or metallization on the substrates. The composite solder connection includes a conductive wire 10, such as copper, extending between openings 12 and 14 in substrate A and substrate B respectively, and surrounded by a solder material 16. Preferably, the wire 10 and surrounding solder 16 extend through openings 12 and 14 in both the substrate A and B. In this type of connection, the solder 16 merely holds the wire 10 in place, and cracking of the solder is immaterial since it does not provide essential electrical connection between the substrates, the essential electrical connection being provided by the wire 10.

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Composite Solder Coil Interconnection

As shown in the figure, which is a longitudinal sectional view, substrate A is connected to substrate B by a composite solder connection to provide electrical connection between the substrates or metallization on the substrates. The composite solder connection includes a conductive wire 10, such as copper, extending between openings 12 and 14 in substrate A and substrate B respectively, and surrounded by a solder material 16. Preferably, the wire 10 and surrounding solder 16 extend through openings 12 and 14 in both the substrate A and B. In this type of connection, the solder 16 merely holds the wire 10 in place, and cracking of the solder is immaterial since it does not provide essential electrical connection between the substrates, the essential electrical connection being provided by the wire 10.

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