Browse Prior Art Database

Compact Packaging Technique

IP.com Disclosure Number: IPCOM000043344D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Swindal, WN: AUTHOR

Abstract

This article describes a technique for obtaining greater thermal dissipation in system packaging. In addition, advantage is taken of flexible media to minimize volume requirements while eliminating typical planar or card on-board packages, thereby decreasing to less than fifty percent the cost of typical packages and improving I/O capacity. In the concept disclosed herein, each module carrier is standard epoxy-glass with connectors. A flexible cable connector completes the connection among the cards. This overcomes a traditional system limitation of cooling. With flexible cable, a flexible heat sink can be clamped against each module cap. The heat is then conducted to a suitable heat sink. The construction is shown in Fig. 1 in partial cross-section.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Compact Packaging Technique

This article describes a technique for obtaining greater thermal dissipation in system packaging. In addition, advantage is taken of flexible media to minimize volume requirements while eliminating typical planar or card on-board packages, thereby decreasing to less than fifty percent the cost of typical packages and improving I/O capacity. In the concept disclosed herein, each module carrier is standard epoxy-glass with connectors. A flexible cable connector completes the connection among the cards. This overcomes a traditional system limitation of cooling. With flexible cable, a flexible heat sink can be clamped against each module cap. The heat is then conducted to a suitable heat sink. The construction is shown in Fig. 1 in partial cross-section. A flexible insulator 1 is positioned between rigid support 2 and module carrier 3 which carries modules 5. A flexible heat sink 4 is clamped against the cap of each module 5. The top surfaces of the modules have to be flat and parallel to a datum plane and of uniform height to make positive contact with heat sink 4 for effective heat transmissibility. Fig. 2 shows the parts broken away from the sandwich package of Fig. 1. The sandwich package can include any required number of cooperating parts between the rigid supports 2. A flexible insulator 1 is positioned between succeeding groups of cooperating parts.

1

Page 2 of 2

2

[This page contains 5 pictures or other non-text objects]