Browse Prior Art Database

Encapsulated Wire Joint Bond Test

IP.com Disclosure Number: IPCOM000043369D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Underkofler, WL: AUTHOR [+2]

Abstract

A test to measure the integrity of a wire to copper plate joint in a wire-encapsulated circuit board is accomplished by the following method: A wire to plated through-hole joint is duplicated in a small test panel (Fig. 1) that consists of several board subassemblies that are laminated together. One of the subassemblies 2 is wired with a series of parallel wires 3, while the other subassemblies 4 have no wires. Sectioning the test panel perpendicular to the wires and grinding the edge flat exposes a series of wire ends 5 for plating. The test panels are mounted to a frame and then subjected to hole cleaning, seeding and plating procedures. The copper plate 6 on the test panel edge is peeled to separate the wire to copper plate joint (Fig. 2).

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Encapsulated Wire Joint Bond Test

A test to measure the integrity of a wire to copper plate joint in a wire- encapsulated circuit board is accomplished by the following method: A wire to plated through-hole joint is duplicated in a small test panel (Fig. 1) that consists of several board subassemblies that are laminated together. One of the subassemblies 2 is wired with a series of parallel wires 3, while the other subassemblies 4 have no wires. Sectioning the test panel perpendicular to the wires and grinding the edge flat exposes a series of wire ends 5 for plating. The test panels are mounted to a frame and then subjected to hole cleaning, seeding and plating procedures. The copper plate 6 on the test panel edge is peeled to separate the wire to copper plate joint (Fig. 2). Measuring the force necessary to peel the copper from the wires gives an indication of the relative wire bond strength. The separation of the copper plate from the laminate occurs at a low load relative to the wire separation load. Thus, the load of wire separation is easily distinguishable above the background load.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]