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Method of Electrically Isolating Drilled Copper Power Planes Using an Isolation Border Without Shorting From Plane to Plane

IP.com Disclosure Number: IPCOM000043485D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Austenfeld, RS: AUTHOR [+3]

Abstract

When using drilled copper power distribution planes in a multilayer circuit board, it is necessary to electrically isolate the active area of each voltage level from the panel locating system and panel edges. This is accomplished by mechanically producing an isolation border in two steps, with an intervening lamination step. However, this isolation border must not allow plane-to-plane shorting within itself. This method staggers the first cuts on the voltage copper planes 11 from the first cuts on the ground copper planes 12. A dielectric 13 is then laminated between the two planes, separating them and filling in the first cuts. The isolation border is completed by a second cut of narrower width, which only exposes one plane of copper in any slot. Thus, plane-to-plane shorting is prevented in the isolation border itself.

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Method of Electrically Isolating Drilled Copper Power Planes Using an Isolation Border Without Shorting From Plane to Plane

When using drilled copper power distribution planes in a multilayer circuit board, it is necessary to electrically isolate the active area of each voltage level from the panel locating system and panel edges. This is accomplished by mechanically producing an isolation border in two steps, with an intervening lamination step. However, this isolation border must not allow plane-to-plane shorting within itself. This method staggers the first cuts on the voltage copper planes 11 from the first cuts on the ground copper planes 12. A dielectric 13 is then laminated between the two planes, separating them and filling in the first cuts. The isolation border is completed by a second cut of narrower width, which only exposes one plane of copper in any slot. Thus, plane-to-plane shorting is prevented in the isolation border itself. This second cut is filled with dielectric during a subsequent lamination step, thereby providing a dielectric "picture frame" which separates the active area from the panel locating system and panel edges.

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