Browse Prior Art Database

Soldering Flux

IP.com Disclosure Number: IPCOM000043497D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR [+2]

Abstract

A soldering flux can be formulated by adding an alkali metal hypophosphite and, more specifically, sodium hypophosphite, to a glycerine-based soldering flux containing EDTA. The hypophosphite is a reducing agent and retards aging of the flux. Such a glycerine-based soldering flux should contain a hypophosphite in an amount effective to stabilize the flux at an elevated temperature in the presence of air. The flux should contain about 87 to 96 percent glycerine, about 2-8 percent EDTA, and about 2 to 5 percent sodium hypoposphite.

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Soldering Flux

A soldering flux can be formulated by adding an alkali metal hypophosphite and, more specifically, sodium hypophosphite, to a glycerine-based soldering flux containing EDTA. The hypophosphite is a reducing agent and retards aging of the flux. Such a glycerine-based soldering flux should contain a hypophosphite in an amount effective to stabilize the flux at an elevated temperature in the presence of air. The flux should contain about 87 to 96 percent glycerine, about 2-8 percent EDTA, and about 2 to 5 percent sodium hypoposphite.

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