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Substrate for Surface Solder Devices

IP.com Disclosure Number: IPCOM000043503D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chellis, LN: AUTHOR [+2]

Abstract

An improved laminate for printed circuit boards can be fabricated by combining quartz resin prepreg with conventional epoxy glass prepreg. The outer or face plies would consist of low thermal expansion material, such as quartz resin prepreg, and the inner plies could consist of conventional glass fabric. By utilizing the quartz resin prepreg on only the outer surfaces, the drillability of the composite will be greatly enhanced. Furthermore, quartz resin prepreg is very expensive, and, hence, this total composite will be relatively inexpensive.

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Substrate for Surface Solder Devices

An improved laminate for printed circuit boards can be fabricated by combining quartz resin prepreg with conventional epoxy glass prepreg. The outer or face plies would consist of low thermal expansion material, such as quartz resin prepreg, and the inner plies could consist of conventional glass fabric. By utilizing the quartz resin prepreg on only the outer surfaces, the drillability of the composite will be greatly enhanced. Furthermore, quartz resin prepreg is very expensive, and, hence, this total composite will be relatively inexpensive.

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