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Fixture for Mounting and Aligning Semiconductor Chips on a Sectioning Block for Unencapsulated Metallurgical Cross-Sectioning

IP.com Disclosure Number: IPCOM000043508D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Christiana, RW: AUTHOR

Abstract

Cross-sectioning (polishing) operations necessary to the preparation of silicon chips for failure analysis, e.g., on a scanning electron microscope, are time-consuming and require very precise alignment of the chip. Defect indications sought during such evaluations are normally very minute, often occurring within metallic lines N 0.0003 inch wide. Inaccurate positioning of the chip sample during sample preparation can result either in (1) many hours of polishing/examination or (2) loss of the sample. Fig. 1 shows the details of an improved fixture which provides a means for conveniently and precisely mounting a chip on a chip mounting block of the type shown in Fig. 2.

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Fixture for Mounting and Aligning Semiconductor Chips on a Sectioning Block for Unencapsulated Metallurgical Cross-Sectioning

Cross-sectioning (polishing) operations necessary to the preparation of silicon chips for failure analysis, e.g., on a scanning electron microscope, are time-consuming and require very precise alignment of the chip. Defect indications sought during such evaluations are normally very minute, often occurring within metallic lines N 0.0003 inch wide. Inaccurate positioning of the chip sample during sample preparation can result either in (1) many hours of polishing/examination or (2) loss of the sample. Fig. 1 shows the details of an improved fixture which provides a means for conveniently and precisely mounting a chip on a chip mounting block of the type shown in Fig. 2. This fixture incorporates precision-milled, multiple depth-gauges for exact chip location/alignment and a heating element to soften the chip mounting medium (glycol wax). The precise distance from the chip sample edge to the defect of interest is first measured by microscope and the appropriate depth gauge mounting block. When the chip has been properly located on the block, the heating element is depowered, allowing the chip bonding medium (wax) to quickly solidify. The following results obtain for perpendicular chip sectioning with the use of this improved fixture: (1) precisely aligned chip, (2) precise chip overlap,

(3) faster chip mount operation, and

(4) reduced risk o...