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Improved Sputter Deposition Thickness at the Center of Printed Circuit Board Throughholes

IP.com Disclosure Number: IPCOM000043514D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Blackwell, K: AUTHOR [+4]

Abstract

This article describes a method which increases the amount of material which can be sputter deposited onto the walls of the center of the throughholes of printed circuit boards by creating a tapered hole instead of a straight one. More material can be sputter deposited onto the walls of the center of the throughholes of printed circuit boards by creating a tapered throughhole 11 instead of a normal straight hole 12 as shown in the figure. The tapered hole 11 could be accomplished by either using a tapered drill, tapered ream, or tapered punch. The resulting 30% increase in the diameter of the tapered hole's opening will lead to an increased thickness of material sputter deposited near the midpoint 13 of the throughhole.

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Improved Sputter Deposition Thickness at the Center of Printed Circuit Board Throughholes

This article describes a method which increases the amount of material which can be sputter deposited onto the walls of the center of the throughholes of printed circuit boards by creating a tapered hole instead of a straight one. More material can be sputter deposited onto the walls of the center of the throughholes of printed circuit boards by creating a tapered throughhole 11 instead of a normal straight hole 12 as shown in the figure. The tapered hole 11 could be accomplished by either using a tapered drill, tapered ream, or tapered punch. The resulting 30% increase in the diameter of the tapered hole's opening will lead to an increased thickness of material sputter deposited near the midpoint 13 of the throughhole.

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