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Technique for Bonding Low Dielectric Constant Polymer Films in Multilayer Circuitry

IP.com Disclosure Number: IPCOM000043539D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chellis, LN: AUTHOR [+3]

Abstract

In order to bond polymer films to circuitized substrates without high temperature, high pressure or the use of adhesives, treat the film in an appropriate solvent to reduce the Tg of the polymer. An alternate approach is to treat the film with an active monomer dissolved in a suitable solvent. Examples are acrylic monomer with catalyst dissolved in chlorinated hydrocarbon solvent or epoxy monomers dissolved in chlorinated solvents or ketones. For thermoplastic polyimide films, suitable amines could be diffused into the film's surface with methanol. After the solvents are removed, the Tg of the polymer film surface remains depressed until an elevated temperature is applied to convert the monomers to polyamic acid.

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Technique for Bonding Low Dielectric Constant Polymer Films in Multilayer Circuitry

In order to bond polymer films to circuitized substrates without high temperature, high pressure or the use of adhesives, treat the film in an appropriate solvent to reduce the Tg of the polymer. An alternate approach is to treat the film with an active monomer dissolved in a suitable solvent. Examples are acrylic monomer with catalyst dissolved in chlorinated hydrocarbon solvent or epoxy monomers dissolved in chlorinated solvents or ketones. For thermoplastic polyimide films, suitable amines could be diffused into the film's surface with methanol. After the solvents are removed, the Tg of the polymer film surface remains depressed until an elevated temperature is applied to convert the monomers to polyamic acid.

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