Browse Prior Art Database

Pinless Module Connector

IP.com Disclosure Number: IPCOM000043674D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 89K

Publishing Venue

IBM

Related People

Murcko, RM: AUTHOR

Abstract

A pinless module connector is designed to make contact with the pads on the bottom of a ceramic module, eliminating the need to braze pins on ceramic pluggable modules. The connector can be soldered into the printed circuit card or board, or can be double ended, giving a connector interface at both the card and module surfaces. The concept uses a buckled beam approach to produce the spring action. The contact interface is a high pressure connection scheme which could allow the use of non-noble interface metallurgy. The connector features a 'Z' stop 11 design that eliminates solder joint creep. The springs 12 are manufactured in strips, and inserted and soldered (13) into the board 14. A connector housing 15 is then positioned over the springs 12 to maintain alignment.

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Pinless Module Connector

A pinless module connector is designed to make contact with the pads on the bottom of a ceramic module, eliminating the need to braze pins on ceramic pluggable modules. The connector can be soldered into the printed circuit card or board, or can be double ended, giving a connector interface at both the card and module surfaces. The concept uses a buckled beam approach to produce the spring action. The contact interface is a high pressure connection scheme which could allow the use of non-noble interface metallurgy. The connector features a 'Z' stop 11 design that eliminates solder joint creep. The springs 12 are manufactured in strips, and inserted and soldered (13) into the board 14. A connector housing 15 is then positioned over the springs 12 to maintain alignment. The spring 12 can be shaped at the contact 16 to represent a point or a smooth rounded interface. Wiping of the contact 16 can be accomplished by the motion (Fig. 2) of the module 17 with respect to connector housing 15 at module insertion. Because of the vertical spring system, very high contact densities can be obtained.

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