Browse Prior Art Database

Closed-Loop Servo Control for RF Sputtering System

IP.com Disclosure Number: IPCOM000043698D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Carruthers, RA: AUTHOR [+4]

Abstract

This article is directed to an improved RF reflective power control system for an RF sputtering system used, for example, to deposit or etch metal or quartz. The improved control system, as shown in the figure, features a dual sensor 1 customized and located at »g position in the RF power line 3 which is ¼g long between RF power supply 5 and RF cathode matching network 7. The customized sensor in this application is suitable for voltage or current standing wave detection, to generate bipolar error voltages to drive, through servo-amplifiers and motors in the matching network 7, multiple tuning elements matching the impedance during sputtering. In an RF sputtering system, such as shown at 9, minor disturbances in the plasma condition may arise during sputter deposition that induce arcing.

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Closed-Loop Servo Control for RF Sputtering System

This article is directed to an improved RF reflective power control system for an RF sputtering system used, for example, to deposit or etch metal or quartz. The improved control system, as shown in the figure, features a dual sensor 1 customized and located at »g position in the RF power line 3 which is 1/4g long between RF power supply 5 and RF cathode matching network 7. The customized sensor in this application is suitable for voltage or current standing wave detection, to generate bipolar error voltages to drive, through servo- amplifiers and motors in the matching network 7, multiple tuning elements matching the impedance during sputtering. In an RF sputtering system, such as shown at 9, minor disturbances in the plasma condition may arise during sputter deposition that induce arcing. When an arc is generated in the chamber, metal from the walls erodes and deposits on the product, reducing the production yield. It has been shown statistically that such contaminants directly affect the yield of integrated circuit chips of sputtered production wafers. Minor arcing can be reduced by using the disclosed reflective power control system which tunes multiple elements in the power matching network.

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