Browse Prior Art Database

Substrate Carrier Frame

IP.com Disclosure Number: IPCOM000043699D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+4]

Abstract

A titanium substrate carrier frame adapts to small substrates that are not compatible with process tooling used in metallized ceramic (MC) manufacturing. A substrate carrier (1) is adaptable to odd size ceramics (2) in MC processing. The substrate (2) is held in the carrier (1) by four mechanical clamps (3). The clamping surfaces are sprung outward to permit easy insertion and removal of the ceramic substrate. The clamping surfaces are moved by using a tool that fits into the holes 4 next to the clamping surfaces and springs the edges of the carrier outward to release the substrate. When the tool releases the carrier, the clamping surfaces spring back to their original position. A relief 5 is provided at two edges of the carrier frame to allow the locating jaws of the expose machine to locate on the substrate 2.

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Substrate Carrier Frame

A titanium substrate carrier frame adapts to small substrates that are not compatible with process tooling used in metallized ceramic (MC) manufacturing. A substrate carrier (1) is adaptable to odd size ceramics (2) in MC processing. The substrate (2) is held in the carrier (1) by four mechanical clamps (3). The clamping surfaces are sprung outward to permit easy insertion and removal of the ceramic substrate. The clamping surfaces are moved by using a tool that fits into the holes 4 next to the clamping surfaces and springs the edges of the carrier outward to release the substrate. When the tool releases the carrier, the clamping surfaces spring back to their original position. A relief 5 is provided at two edges of the carrier frame to allow the locating jaws of the expose machine to locate on the substrate 2. The raw ceramic is clamped to the carrier prior to metallization and remains in the carrier throughout the MC process. The carrier has the additional advantage of protecting the edges of the ceramic from nicks and cracks.

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