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Browse Prior Art Database

Chip Temperature Measurement

IP.com Disclosure Number: IPCOM000043712D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Jung, E: AUTHOR [+4]

Abstract

Measuring the operating temperature of a semiconductor chip is indispensable, since a particular maximum operating temperature must not be exceeded and such temperature measurements are indicative of the reliability of the chip. Known methods, which have proved inaccurate, measure the chip temperature by measuring the temperature and the speed of the cooling air, thus providing an estimate of the power dissipation, so that the chip temperature can be determined by means of a computing model. With the aid of the method described below, the operating temperature of the chip can be directly measured. On every chip, or at least on every chip with increased power dissipation, a special measuring circuit is integrated along with the chip.

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Chip Temperature Measurement

Measuring the operating temperature of a semiconductor chip is indispensable, since a particular maximum operating temperature must not be exceeded and such temperature measurements are indicative of the reliability of the chip. Known methods, which have proved inaccurate, measure the chip temperature by measuring the temperature and the speed of the cooling air, thus providing an estimate of the power dissipation, so that the chip temperature can be determined by means of a computing model. With the aid of the method described below, the operating temperature of the chip can be directly measured. On every chip, or at least on every chip with increased power dissipation, a special measuring circuit is integrated along with the chip. As shown in the figure, this circuit consists of two diodes D1 and D2, connected anti-parallel to each other, and a resistor R1 series-connected to diode D1. Diodes D1 and D2 are of the same size and have tracking properties. For temperature measurements, diode D2 is used such that a known current is forced through it. The potential at points A and B is indicative of the chip temperature. The temperature/voltage drop ratio VA-B can be easily determined. Diode D1 is off, so that R1 has no effect. The value of R1 is determined by forcing a current through diode D1 and by measuring the voltage drop VB-A at points B and A. For determining the value of R1, the voltage VB-C at either end of the resistor is divided by the current I flowing through R1. For this purpose the relation

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is used. If the same current I is used in both measuring steps, t...