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Module Seal Band Solder Dressing Process

IP.com Disclosure Number: IPCOM000043759D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Modlo, RJ: AUTHOR [+2]

Abstract

A process for reworking a hermetically sealed module requires the removal of the cap, attached to the substrate by a solder seal, thereby exposing a rough irregular surface on the remaining solder of the ceramic surface. The reworking process begins by reflowing the solder ring and removing the residual solder. The remaining solder is then dressed to produce a flat surface whereby a new cap is attached to the reworked module. A porous copper window 1 has two different meltpoint solder sheets 2,3 attached. The top solder sheet 2 has the same meltpoint as the solder 7 on the module 6 which has to be dressed. The bottom solder sheet 3 has a slightly higher melting point. The copper window-solder assembly 4 nests into a graphite fixture 5.

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Module Seal Band Solder Dressing Process

A process for reworking a hermetically sealed module requires the removal of the cap, attached to the substrate by a solder seal, thereby exposing a rough irregular surface on the remaining solder of the ceramic surface. The reworking process begins by reflowing the solder ring and removing the residual solder. The remaining solder is then dressed to produce a flat surface whereby a new cap is attached to the reworked module. A porous copper window 1 has two different meltpoint solder sheets 2,3 attached. The top solder sheet 2 has the same meltpoint as the solder 7 on the module 6 which has to be dressed. The bottom solder sheet 3 has a slightly higher melting point. The copper window- solder assembly 4 nests into a graphite fixture 5. The module 6 is located and held by the graphite fixture while maintaining contact between the module solder area 7 and the top solder sheet 2. This interface is maintained and the top solder sheet 2 melts, and is absorbed, along with the solder to be dressed, by the porous copper 1 with gravity maintaining the contact. The window-solder assembly 4 is placed into the fixture 5, and the module 6 is then placed into the fixture on top of this assembly. The total assembly is put through an atmospherically controlled furnace. As the assembly passes through the furnace, the top sheet of solder melts, wetting the solder seal 7 on the module. The excess solder is drawn by capillary action into the...