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Enhanced Printed Circuit Board Design-Solder Mask Wiring Plane Relationship

IP.com Disclosure Number: IPCOM000043797D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

De Marco, JL: AUTHOR [+8]

Abstract

In the current design of solder mask/wire bond pads on the plane of printed circuit boards only two of the four sides of each wire bond pad are defined by the solder mask (Fig. 1). This condition restricts the molten solder's flow to just two directions, causing problems such as a high level of solder shorts between signal and ground pads, and spacing violations during the wire bonding operations. A design is provided in which the solder mask no longer defines two of four sides of each wire bond pad. With the "H" pattern design (Fig. 2) the molten solder is free to flow into the epoxy area 11 on either side of each bond pad 12, 13.

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Enhanced Printed Circuit Board Design-Solder Mask Wiring Plane Relationship

In the current design of solder mask/wire bond pads on the plane of printed circuit boards only two of the four sides of each wire bond pad are defined by the solder mask (Fig. 1). This condition restricts the molten solder's flow to just two directions, causing problems such as a high level of solder shorts between signal and ground pads, and spacing violations during the wire bonding operations. A design is provided in which the solder mask no longer defines two of four sides of each wire bond pad. With the "H" pattern design (Fig. 2) the molten solder is free to flow into the epoxy area 11 on either side of each bond pad 12, 13. The three- dimensional relationship between the solder mask 14 and the wiring plane allows the molten solder increased mobility, thus significantly reducing the occurrence of solder shorts and spacing violations.

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