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High Density Memory Package

IP.com Disclosure Number: IPCOM000043814D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Kerjilian, GK: AUTHOR [+4]

Abstract

Hermetically sealed and densely packed chips or modules 1 can be effectively cooled, irrespective of their mechanical relationship, if they are mounted on a flexible circuit 2. This flexible circuit is placed around a foam rubber mat 3, so that the chips are arranged on either side (Fig. 1). The package is transferred to a metal housing 4, by which mat 3 is compressed. As a result, the chips are pressed against metal housing 4 for heat discharge. The two ends of the flexible circuit are linked with a connector 5, positioned on the left hand side of metal housing 4 and serving to plug the circuitry package into a socket of another card or board. It is also possible to replace the flexible circuit loop by two flexible circuits 2a, 2b (Fig.

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High Density Memory Package

Hermetically sealed and densely packed chips or modules 1 can be effectively cooled, irrespective of their mechanical relationship, if they are mounted on a flexible circuit 2. This flexible circuit is placed around a foam rubber mat 3, so that the chips are arranged on either side (Fig. 1). The package is transferred to a metal housing 4, by which mat 3 is compressed. As a result, the chips are pressed against metal housing 4 for heat discharge. The two ends of the flexible circuit are linked with a connector 5, positioned on the left hand side of metal housing 4 and serving to plug the circuitry package into a socket of another card or board. It is also possible to replace the flexible circuit loop by two flexible circuits 2a, 2b (Fig. 2) with chips on either side of mat 3, if connectors 5a, 5b are required on both sides of the assembly.

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