Browse Prior Art Database

Enhanced Solder Wettability of Multilayer Ceramic Substrates

IP.com Disclosure Number: IPCOM000043861D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pressman, F: AUTHOR [+2]

Abstract

Multilayer ceramic substrates employ a seal band on the periphery thereof for attaching an encapsulating cap thereto. It has been found that lead-tin solder does not wet well with the nickel seal band. Improved wetting may be obtained by immersion plating a thin film (e.g., 400-1200 ˜) of gold to the nickel seal band. This immersion plating can be applied as a separate operation or concurrently with gold electroplating of other features on the multilayer ceramic substrate. When performed concurrently, the seal band is exposed to the gold electroplating solution. No electrical contact is made to the seal band, so that it receives an immersion deposit, while the other features become electroplated with gold.

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Enhanced Solder Wettability of Multilayer Ceramic Substrates

Multilayer ceramic substrates employ a seal band on the periphery thereof for attaching an encapsulating cap thereto. It has been found that lead-tin solder does not wet well with the nickel seal band. Improved wetting may be obtained by immersion plating a thin film (e.g., 400-1200 ~) of gold to the nickel seal band. This immersion plating can be applied as a separate operation or concurrently with gold electroplating of other features on the multilayer ceramic substrate. When performed concurrently, the seal band is exposed to the gold electroplating solution. No electrical contact is made to the seal band, so that it receives an immersion deposit, while the other features become electroplated with gold.

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