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Method for Securing Leaded Surface Mounted Components

IP.com Disclosure Number: IPCOM000043874D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

DeBoskey, WR: AUTHOR [+2]

Abstract

This article describes a technique for tacking leaded components onto the surface of a circuit card or substrate prior to passing the card through a wave solder operation for soldering the component to the card. The process is as follows: (1) Dispense an amount of adhesive in a tower formation in the center of the component site on the card. The height of the tower should be approximately the same as the distance between the bottom of the carrier and the area of the lead to be soldered to the card. (2) Dispense approximately the same amount of adhesive to the bottom side of the component in the center of the body. This also should be in a tower formation. (3) Invert the leaded carrier and place on the site where it is to be soldered, assuring proper orientation.

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Method for Securing Leaded Surface Mounted Components

This article describes a technique for tacking leaded components onto the surface of a circuit card or substrate prior to passing the card through a wave solder operation for soldering the component to the card. The process is as follows: (1) Dispense an amount of adhesive in a tower formation in the center of the component site on the card. The height of the tower should be approximately the same as the distance between the bottom of the carrier and the area of the lead to be soldered to the card. (2) Dispense approximately the same amount of adhesive to the bottom side of the component in the center of the body. This also should be in a tower formation. (3) Invert the leaded carrier and place on the site where it is to be soldered, assuring proper orientation. Apply an amount of pressure to the top of the carrier to merge the two adhesive towers. (4) Allow the adhesive to cure for the prescribed cure time and temperature, if applicable. (5) The assembly can now be fluxed, inverted, and run through the wave solder operation. (6) The rheology of commonly available adhesives allows slumping to occur with height to tower diameter ratios greater than about one to one. By using this double dot method, tower heights greater than one to one may easily be built up without slumping.

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