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Browse Prior Art Database

Signal Core by Direct Circuit Deposition

IP.com Disclosure Number: IPCOM000043901D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Chellis, LN: AUTHOR [+2]

Abstract

A signal core for a printed circuit board can be fabricated as follows: 1. Laminate (Fig. 1) a flush core 2 using prepunched copper foil having clearance holes 3 for plated through holes and signal intersticial Via (IVs). Slurry scrub surface to remove resin flush, and prepare surface for adhesion. Core could be.0015" glass fabric - BT epoxy, polyimide, high temperature epoxy, or other heat-resistant laminate. 2. Chlorite or otherwise oxidize or treat copper surface to improve adhesion. 3. Laminate controlled thickness film 4 of polysulfone or other high temperature, low dielectric constant film that is amenable to swell and etch process. 4. Drill (Fig. 2) signal IVs 5. 5. Swell and etch surfaces 6, then seed surfaces. 6. Apply photoresist 7, expose, and develop signal patterns 8, as shown in Fig. 3. 7.

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Signal Core by Direct Circuit Deposition

A signal core for a printed circuit board can be fabricated as follows: 1. Laminate (Fig. 1) a flush core 2 using prepunched copper foil having clearance holes 3 for plated through holes and signal intersticial Via (IVs). Slurry scrub surface to remove resin flush, and prepare surface for adhesion. Core could be.0015" glass fabric - BT epoxy, polyimide, high temperature epoxy, or other heat-resistant laminate. 2. Chlorite or otherwise oxidize or treat copper surface to improve adhesion. 3. Laminate controlled thickness film 4 of polysulfone or other high temperature, low dielectric constant film that is amenable to swell and etch process. 4. Drill (Fig. 2) signal IVs 5. 5. Swell and etch surfaces 6, then seed surfaces. 6. Apply photoresist 7, expose, and develop signal patterns 8, as shown in Fig. 3. 7. Plate copper in additive or electrolytic bath. 8. Strip photoresist 7, and flash etch seeder. See Fig. 4.

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