Browse Prior Art Database

Automated Semiconductor Module Assembly Process

IP.com Disclosure Number: IPCOM000043930D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 75K

Publishing Venue

IBM

Related People

Graham, MA: AUTHOR [+3]

Abstract

In this process, the handling and inventorying of semiconductor devices or VLSI chips in package assembly operations is reduced by directly picking the devices from the wafers. In the usual automated assembly of semiconductor devices on module substrates, the semiconductor devices required for the individual substrate are sorted and assembled into a kit. The kit must be stored and matched up with the substrate just prior to the placement of the devices on the substrate by the automated placement apparatus. This results in excessive device inspections, handling and inventory procedures which can damage the devices, and present the possibility of assembly errors.

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Automated Semiconductor Module Assembly Process

In this process, the handling and inventorying of semiconductor devices or VLSI chips in package assembly operations is reduced by directly picking the devices from the wafers. In the usual automated assembly of semiconductor devices on module substrates, the semiconductor devices required for the individual substrate are sorted and assembled into a kit. The kit must be stored and matched up with the substrate just prior to the placement of the devices on the substrate by the automated placement apparatus. This results in excessive device inspections, handling and inventory procedures which can damage the devices, and present the possibility of assembly errors. In this process, diced wafers are pre-mounted on a precision wafer platen which contains a man/machine readable serial number which correlates with the wafer serial numbers. In a similar manner, substrates are mounted in carriers contained in module cubes. Automatic parallel continuous flow of wafers and substrates occurs within the automated device placement system of Fig. 1 with direct serial number traceability and correlation between wafer and substrate maps and serial number history files for both sub products. Wafer platen accessing is performed by a random-access buffer with serial number read prior to entering the chip- placement apparatus of Fig. 2. This system is comprised of a chip pick probe 115, chip registration/nesting probe 120, transfer arm 1...