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Post Solder Cleaning Process for Metallized Ceramics

IP.com Disclosure Number: IPCOM000043935D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Anschel, M: AUTHOR [+3]

Abstract

Post solder cleaning on metallized ceramic (MC) substrates to remove deleterious contaminants, byproducts of rosin and possible inhibitor contaminants, is accomplished by the following steps: 1. Ultrasonically (40 KHz) clean the MC substrates in commercial monoethanolamine*, butyl CARBITOL (Trademark of Union Carbide Corporation)*, N-methylpyrrolidone**, non-ionic surfactants**, solvent system at room temperature (N 21 C) for one minute. 2. Rinse the substrates for 30 seconds with deionized water at room temperature. 3. Repeat step 2 in a second bath. 4. Ultrasonically (40 KHz) clean the substrates in commercial 65-80% 1,1,2-trichloro 1,2,2-trifluoroethane/20-35% isopropanol with 1.7% max methylchloroform solvent system at room temperature for one minute. 5. Dry the parts in N2 . *Major Constituents **Minor constituents

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Post Solder Cleaning Process for Metallized Ceramics

Post solder cleaning on metallized ceramic (MC) substrates to remove deleterious contaminants, byproducts of rosin and possible inhibitor contaminants, is accomplished by the following steps: 1. Ultrasonically (40 KHz) clean the MC substrates in commercial monoethanolamine*, butyl CARBITOL (Trademark of Union Carbide Corporation)*, N-methylpyrrolidone**, non-ionic surfactants**, solvent system at room temperature (N 21 C) for one minute. 2. Rinse the substrates for 30 seconds with deionized water at room temperature.
3. Repeat step 2 in a second bath. 4. Ultrasonically (40 KHz) clean the substrates in commercial 65-80% 1,1,2-trichloro 1,2,2-trifluoroethane/20-35% isopropanol with 1.7% max methylchloroform solvent system at room temperature for one minute. 5. Dry the parts in N2 . *Major Constituents **Minor constituents

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