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Removal of Metallic Complex Contaminants From Chrome-Copper-Chrome Interconnection Patterns on a Polyimide Substrate

IP.com Disclosure Number: IPCOM000043949D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Hamilton, N: AUTHOR [+2]

Abstract

This disclosure details a process used to remove metal and metallic complex contaminants by using the following: Solution A - DI water, Ammonium Hydroxide, Hydrogen Peroxide 5 Parts H2O 1 Part NH4OH 1 Part H2O2 Solution B - DI Water, Hydrochloric Acid, Hydrogen Peroxide 5 Parts H2O 1 Part HCl 1 Part H2O2 Solution C - Chromium Trioxide, Phosphoric Acid, Water 160 g - CrO3 160 ml - H3PO4 8000 ml - H2O The above solutions can be used in sequence or by themselves depending on the particular contaminant. The contaminants generally result from inadequate etching and/or rinsing during pattern definition and can create an electrical leakage path between interconnections. Solution A (basic) is very effective in removing organic contaminants via the solvation action of NH4OH and the oxidizing action of H2O2 .

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Removal of Metallic Complex Contaminants From Chrome-Copper-Chrome Interconnection Patterns on a Polyimide Substrate

This disclosure details a process used to remove metal and metallic complex contaminants by using the following: Solution A - DI water, Ammonium Hydroxide, Hydrogen Peroxide 5 Parts H2O 1 Part NH4OH 1 Part H2O2 Solution B - DI Water, Hydrochloric Acid, Hydrogen Peroxide 5 Parts H2O 1 Part HCl 1 Part H2O2 Solution C - Chromium Trioxide, Phosphoric Acid, Water 160 g - CrO3 160 ml - H3PO4 8000 ml - H2O The above solutions can be used in sequence or by themselves depending on the particular contaminant. The contaminants generally result from inadequate etching and/or rinsing during pattern definition and can create an electrical leakage path between interconnections. Solution A (basic) is very effective in removing organic contaminants via the solvation action of NH4OH and the oxidizing action of H2O2
. NH4OH also complexes group I and II metals like copper:

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Solution B (acidic) is very effective in desorbing metal contaminants via complexing. Also, elevated temperatures increase the oxidation potential of acidic H2O2 system and increases the efficiency of desorption. Solution C (chromic phosphoric acid) will remove any metal oxide formation.

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