Browse Prior Art Database

Process for Lift-Off Pattern Cross-Sectional Control

IP.com Disclosure Number: IPCOM000043993D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Bertelsen, BI: AUTHOR [+2]

Abstract

This article describes a process which creates the overhang necessary for good lift-off by depositing metal from a grazing angle onto a rotating substrate. Edge-taper control of the metal lines is obtained by controlling the relative rates of metal deposition from the grazing angle and the normal angle. For the deposition portion of the lift-off patterning process, either vacuum deposition, S-gun sputter deposition or ion beam deposition can be used. Process Description 1. Create a pattern of vertical wall (or slightly undercut) openings in a material which can be dissolved after depositing the material to be patterned. 2. Mount the substrate 11 in its rotating holder in the deposition system (Fig. 1). Evacuate the system and begin depositing from the grazing angle source 12 first.

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Process for Lift-Off Pattern Cross-Sectional Control

This article describes a process which creates the overhang necessary for good lift-off by depositing metal from a grazing angle onto a rotating substrate. Edge- taper control of the metal lines is obtained by controlling the relative rates of metal deposition from the grazing angle and the normal angle. For the deposition portion of the lift-off patterning process, either vacuum deposition, S- gun sputter deposition or ion beam deposition can be used. Process Description
1. Create a pattern of vertical wall (or slightly undercut) openings in a material which can be dissolved after depositing the material to be patterned. 2. Mount the substrate 11 in its rotating holder in the deposition system (Fig. 1). Evacuate the system and begin depositing from the grazing angle source 12 first. After depositing a quantity on the edge 13 of the openings sufficient to define the pattern basewidth, begin depositing from the normal source 14. The relative deposition rates will define the pattern edge slope 15 (Fig. 2). 3. Normal lift-off processes will leave the patterned cross section shown in Fig. 2.

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