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Browse Prior Art Database

Control of Plasma Etch Uniformity by Electrode Spacing

IP.com Disclosure Number: IPCOM000043999D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

White, RF: AUTHOR [+2]

Abstract

Improved control of plasma etch uniformity is achieved by the adjustment of electrode spacing in large multi-cell plasma etch reactors. Etch rates are directly proportional to the electrode spacing within a cell. The etch rate from cell to cell can be varied by changing the distance between the electrodes which define the cell. The etch rate within a cell can be varied by contouring the electrode faces appropriately.

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Control of Plasma Etch Uniformity by Electrode Spacing

Improved control of plasma etch uniformity is achieved by the adjustment of electrode spacing in large multi-cell plasma etch reactors. Etch rates are directly proportional to the electrode spacing within a cell. The etch rate from cell to cell can be varied by changing the distance between the electrodes which define the cell. The etch rate within a cell can be varied by contouring the electrode faces appropriately.

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