Browse Prior Art Database

Selective Signal or Voltage Module Substrate Connection

IP.com Disclosure Number: IPCOM000044074D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Stoops, EH: AUTHOR

Abstract

The figure illustrates a cross-sectional view of a multilayer ceramic substrate 2 which includes outer ground planes 4 and 6 which sandwich a signal plane 8. On the underside of the multilayer ceramic substrate will be connected pins 10 which are to be the physical mounting mechanism and electrical interconnecting means with the next higher level of package. On the opposite side of the multilayer ceramic substrate 2 is the post 12 which is physically mounted on the upper side of the substrate and is electrically connected to either a voltage plane or a signal plane on the substrate and which serves to physically support and electrically connect to interconnection wiring to the VLSI (very large-scale integration) chip.

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Selective Signal or Voltage Module Substrate Connection

The figure illustrates a cross-sectional view of a multilayer ceramic substrate 2 which includes outer ground planes 4 and 6 which sandwich a signal plane 8. On the underside of the multilayer ceramic substrate will be connected pins 10 which are to be the physical mounting mechanism and electrical interconnecting means with the next higher level of package. On the opposite side of the multilayer ceramic substrate 2 is the post 12 which is physically mounted on the upper side of the substrate and is electrically connected to either a voltage plane or a signal plane on the substrate and which serves to physically support and electrically connect to interconnection wiring to the VLSI (very large-scale integration) chip. The problem solved by the invention is how to selectively change the use of a particular post and pin pair on the multilayer ceramic substrate from a voltage application to a signal application. This is achieved by providing a signal path 18 which connects the post 12 to the signal plane 8 and a signal path 22 which connects the pin 10 to the signal plane 8 and still further by providing a selectively severable power path 14 between the post 12 and the ground plane 2 (power plane) and the selectively severable path 24 between the pin 10 and the ground (power plane) 4. If the ground (power plane) 4 and 6 are to be of the same potential, they can be connected in common by means of the strap 20. I...