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Method of Improving the Adhesion of Metallic Layers on Curable Plastics

IP.com Disclosure Number: IPCOM000044084D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Czepluch, H: AUTHOR [+4]

Abstract

Partially cured epoxy resin material is copper-coated by magnetron sputtering. The temperature, occurring during sputtering by secondary electron bombardment, causes the partially cured epoxy resin material to be almost completely cross-linked and the sputtered copper atoms to be stably linked to the resultant active centers of the resin system, thus considerably improving the adhesion of the copper to the epoxy resin laminate. Example In a heated laminating press, epoxy resin prepregs (4 layers of glass-fiber-reinforced epoxy resin) are pressed at 140ŒC and a vacuum of about 4O mbar for about 2 hours between so-called sacrificial copper foils. This extremely low laminating temperature (the standard temperature being about 190ŒC) yields a cross-linkage of about 80 to 85%.

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Method of Improving the Adhesion of Metallic Layers on Curable Plastics

Partially cured epoxy resin material is copper-coated by magnetron sputtering. The temperature, occurring during sputtering by secondary electron bombardment, causes the partially cured epoxy resin material to be almost completely cross-linked and the sputtered copper atoms to be stably linked to the resultant active centers of the resin system, thus considerably improving the adhesion of the copper to the epoxy resin laminate. Example In a heated laminating press, epoxy resin prepregs (4 layers of glass-fiber-reinforced epoxy resin) are pressed at 140OEC and a vacuum of about 4O mbar for about 2 hours between so-called sacrificial copper foils. This extremely low laminating temperature (the standard temperature being about 190OEC) yields a cross-linkage of about 80 to 85%. Subsequently, the copper foils are etched in a continuous etch system, using an acid CuCl2 solution, so that a dendritically roughened, but not completely cross-linked, laminate is obtained. In a DC magnetron (continuous) sputter system, this laminate is provided with a copper layer of about 0.2 to 0.5 m. The sputter parameters are: Pumping the system to: 2 x 10-5 mbar Speed: 1 cm/sec. Current: 25 to 30 amperes Voltage: 520 Volts Ar partial pressure: 5 x 10-5 mbar Temperature: 130 C In a standard additive bath, the copper-coated laminate is electrolessly copper-plated to a total thickness of about 35 m. In a pull test, the...