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Plasma Polymer Surface Adhesion Modification Method

IP.com Disclosure Number: IPCOM000044112D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Nguyen, SV: AUTHOR [+2]

Abstract

A plasma polymer surface adhesion modification method improves the surface adhesion of plasma-deposited polymer for image resist. This surface modification and deposition process, in which the polymer surface adhesion can be modified to a desirable degree, has no negative effects on the polymer film properties. It is generally defect-free, suffers low stress, provides uniform coating, and is done during the deposition of the polymer film. In this method, reactive gases, such as nitrogen (N2) or oxygen (O2) 11, are introduced during the final stage of the deposition process, thus modifying the top layer of the polymer 12 to the appropriate adhesion. Monomer gas 13 (siloxane) is also introduced into the system.

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Plasma Polymer Surface Adhesion Modification Method

A plasma polymer surface adhesion modification method improves the surface adhesion of plasma-deposited polymer for image resist. This surface modification and deposition process, in which the polymer surface adhesion can be modified to a desirable degree, has no negative effects on the polymer film properties. It is generally defect-free, suffers low stress, provides uniform coating, and is done during the deposition of the polymer film. In this method, reactive gases, such as nitrogen (N2) or oxygen (O2) 11, are introduced during the final stage of the deposition process, thus modifying the top layer of the polymer 12 to the appropriate adhesion. Monomer gas 13 (siloxane) is also introduced into the system. Since both monomer gas 13 and nitrogen 11 (or O2, N22O) were introduced together during the final stage of the deposition process, the top layer of N2-enriched polymer 14 will be compatible with the lower layer and most of its physical properties will be similar. For example, deposit 1000 A of siloxane polymer 15 as a middle layer for a multilayer resist image with a wetting angle,
i.e., with surface adhesion, from 45 to 65OE. After depositing 900 A of siloxane polymer 15 in the installed plasma reactor, N2 or O2 or N2O gas is introduced into the monomer gas plasma, thus modifying the structure of the last 100 A film and resulting in a change in surface adhesion (i.e., wetting angle). This deposition techni...