Browse Prior Art Database

Removal of Pores and Fissures in Thick Ceramic Films

IP.com Disclosure Number: IPCOM000044162D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Brownlow, JM: AUTHOR

Abstract

Ceramic dielectrics and glasses sometimes require heavy slurries in thickness of 12 to 30 microns. Elimination of porosity, fissures and craters in such thicknesses is difficult. The use of high temperatures is often restrictive. To eliminate these flaws and to lower the densification temperature, hot isostatic pressing (HIP) with an interposed thin metal membrane is employed in the following steps, as shown in the figure. 1. First, the thick film slurry is applied and baked to remove organic vehicles and to establish desired oxygen content. 2. Second, the part is placed in a metal envelope. The top is a thin metal membrane of Cu, Au, Ag, Ni, Fe, INVAR* which is opposed to the slurry surface. The envelope is welded closed. 3.

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Removal of Pores and Fissures in Thick Ceramic Films

Ceramic dielectrics and glasses sometimes require heavy slurries in thickness of 12 to 30 microns. Elimination of porosity, fissures and craters in such thicknesses is difficult. The use of high temperatures is often restrictive. To eliminate these flaws and to lower the densification temperature, hot isostatic pressing (HIP) with an interposed thin metal membrane is employed in the following steps, as shown in the figure. 1. First, the thick film slurry is applied and baked to remove organic vehicles and to establish desired oxygen content.
2. Second, the part is placed in a metal envelope. The top is a thin metal membrane of Cu, Au, Ag, Ni, Fe, INVAR* which is opposed to the slurry surface. The envelope is welded closed. 3. Third, the whole is subjected to a temperature- time program in the HIP machine to produce the desired densification and properties. The electrode may be the same as the membrane metal, for example, 5-micron gold-plated copper, left in place and employed as part of the component. Studs may be preformed on the membrane to make contact through the hot deformable slurry to metal or to studs on the substrate. This substitutes for via forming and stud forming in the usual circuit forming methods. It may be useful to include in the slurry a sufficient number of particles of the size of final film thickness to insure thickness uniformity. * Trademark of International Nickel Company.

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