Browse Prior Art Database

In Situ Stress Measurement

IP.com Disclosure Number: IPCOM000044201D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Dustin, DR: AUTHOR [+2]

Abstract

The mechanism shown above provides detection for overstress (shock-vibration) of a substrate or module. Handling in fabrication, shipment or installation can produce electrical malfunction due to stress-induced damage if the stresses are large enough in magnitude. By providing an electrical circuit that is built into a module in an area which would be expected to be damaged by shock-vibration stresses, the device can be tuned to react at a level of stress which signals the onset of damage to the functional operation of the module. In this way, system malfunction can be prevented, and the reliability objectives can be maintained. Fig. 1 shows the general physical layout of the measurement device.

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In Situ Stress Measurement

The mechanism shown above provides detection for overstress (shock- vibration) of a substrate or module. Handling in fabrication, shipment or installation can produce electrical malfunction due to stress-induced damage if the stresses are large enough in magnitude. By providing an electrical circuit that is built into a module in an area which would be expected to be damaged by shock-vibration stresses, the device can be tuned to react at a level of stress which signals the onset of damage to the functional operation of the module. In this way, system malfunction can be prevented, and the reliability objectives can be maintained. Fig. 1 shows the general physical layout of the measurement device. The principal involves the utilization of the chip quartz layer as a crack propagation medium and interlevel via structures to form the electrical detection network. Should an externally induced stress occur, a crack will propagate in this area through the micro via structure, opening the electrical circuit shown in Fig. 2. This device can be applied to any unused chip location on a module. The sensitivity of the system is adjusted by varying the micro via location and the number of these devices designed into the chip.

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