Browse Prior Art Database

Bubble Heat Sink

IP.com Disclosure Number: IPCOM000044378D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Modlo, RJ: AUTHOR [+4]

Abstract

A bubble heat sink is a device used to disperse heat from the chip to the cap within a module as the heat, generated within a module, increases. Fig. 1 shows that the bubble heat sink consists of a membrane material 11 formed into a bubble surface 12 on one side and a relatively flat surface 13 on the back side. Air captivated within the bubble 12 provides a spring action when it is compressed, providing a gentle and intimate pressure to the top surface of the chip. This produces a good thermally conductive path to the module cap. The bubble 12 is copper clad by plating, evaporation, or sputtering, and this copper 14 provides an excellent heat transfer medium between the chip 15 and the module cap 16. The bubble heat sink 12 can be attached to the bottom side of the cap 16, as shown in Fig.

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Bubble Heat Sink

A bubble heat sink is a device used to disperse heat from the chip to the cap within a module as the heat, generated within a module, increases. Fig. 1 shows that the bubble heat sink consists of a membrane material 11 formed into a bubble surface 12 on one side and a relatively flat surface 13 on the back side. Air captivated within the bubble 12 provides a spring action when it is compressed, providing a gentle and intimate pressure to the top surface of the chip. This produces a good thermally conductive path to the module cap. The bubble 12 is copper clad by plating, evaporation, or sputtering, and this copper 14 provides an excellent heat transfer medium between the chip 15 and the module cap 16. The bubble heat sink 12 can be attached to the bottom side of the cap 16, as shown in Fig. 2, or to the top side of the cap 16, as in Fig. 3.

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