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Sandwich Heat Sinks With Hybrid Cooling for High Power Electronic Component Packaging

IP.com Disclosure Number: IPCOM000044380D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-05
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Chan, JY: AUTHOR [+3]

Abstract

A hybrid cooling system for high power electronic component packaging can combine two of the three common cooling methods: forced air cooling, liquid cooling and air-conditioned cooling. This combination is more reliable in that if one cooling system fails, the other will be sufficient to prevent catastrophic failure. In Fig 1, two sandwich plates 2, 3 with electronic components 4 contain rows of thin-walled square tubes 5 through which water or another coolant circulates. The tubes are separated by air gaps 6 through which cooling air is forced. The air flows opposite to the flow of water, thereby providing a more uniform heat dissipation of the sandwich plates. The air flow over the pipes may be made to flow in a transverse direction, as in the modified version shown in Fig. 2.

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Sandwich Heat Sinks With Hybrid Cooling for High Power Electronic Component Packaging

A hybrid cooling system for high power electronic component packaging can combine two of the three common cooling methods: forced air cooling, liquid cooling and air-conditioned cooling. This combination is more reliable in that if one cooling system fails, the other will be sufficient to prevent catastrophic failure. In Fig 1, two sandwich plates 2, 3 with electronic components 4 contain rows of thin-walled square tubes 5 through which water or another coolant circulates. The tubes are separated by air gaps 6 through which cooling air is forced. The air flows opposite to the flow of water, thereby providing a more uniform heat dissipation of the sandwich plates. The air flow over the pipes may be made to flow in a transverse direction, as in the modified version shown in Fig. 2.

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